A semiconductor high-tech enterprise is working hard to complete the independent control of key semiconductor bonding technologies, get rid of the long-term import monopoly in the semiconductor packaging and testing links, and contribute to the localization of key semiconductor packaging and testing equipment.
Provocatio
In processus of continuously meliorem processus gradu de vinculum apparatus apparatu, electrica automation application of apparatu facta est clavis. Ideo quod est magni momenti component et potestate centrum de vinculum apparatus apparatus apparatu, electrica imperium est core component ut firmum, reliable et efficientem in apparatu.
Ut ad consequi hoc metam, in comitatu primo indiget eligere idoneam imperium scrinia Switching potestate copia productum, et key factores ad considerans includit:
I. Volume Supple
II. Voltage et Current stabilitatem
III. Potestas copia calor resistentia
Solution
Weidmullerpromax Series Single-Switching Power copiam praebet targeted professional solutions pro praecisione Automation applications ut Semiconductors.
IPacto consilio,
In minimam potentia 70W potentia moduli non solum 32mm lata, quae est valde idoneam ad angustum spatii intra bonding arca.
IIFirmiter manubrio ad XX% continuam overload vel CCC% apicem onus,
Semper stabili output, et consequi excelsum boost facultatem et plenam potestatem.
IIIPotest operari in altum temperatus amet electrica scrinium,
Etiam usque ad LX ° C, et quoque esse coepi in -40 ° c.
Beneficia pro customers
Postquam adoptando WeidmullerPromax Series Single-Phase Switching Power Supple, De Company solvitur curarum de electrica imperium potentia copia semiconductor Banning apparatus apparatus et effectum:
Magnum nisi in spatio in arca: Auxilium customers redigendum spatium virtutis copia in scrinium circiter XXX%, et amplio spatium USUS rate.
Consequi certa et firmum operationem: ut certa et firmum operationem in components in toto electrica scrinium.
Occursum in dura working environment de electrica scrinium: eliminate de de angustiis ut calefacit et evacuatione ex components.
In via ad localization of siconductor apparatu, packaging et testis apparatu repraesentatur per vinculum machinis instanter postulo ut amplio eorum technica gradu. In terms of testimonii ad electrica automation requisita de vinculum apparatus apparatu, Weidmuller, cum altum experientia in agro electrica nexu et ducens industria et parva-amplitudo ad Semiconds et testis et parva-amplitudo ad semiconductor et testis in parva-amplitudo ad Semiconductor et Testis et Testing Partial Manufacturers.
Post tempus: Jun 14-2024