Hirschmann RSP35-08033O6TT-EK9Y9HPE2SXX.X.XX Foedus Managed Industrial DIN Rail Cie
Descriptio | Managed Industrial Switch for DIN Rail, fanless design Fast Ethernet, Gigabit uplink type - Consectetur (PRP, Fast MRP, HSR, NAT (-FE only) with L3 type) |
Portus genus et quantitas | 11 Portus in summa: 3 x SFP foramina (100/1000 Mbit/s); 8x 10/100BASE TX / RJ45 |
Virtus copia / significat contactum | 1 x obturaculum in stipitem terminalem, 3-pinum; 1 x obturaculum-in scandalum terminale, 2-pin |
V.24 interface | 1 x RJ11 nervum |
SD-card socors | I x SD card socors coniungere auto configuratione nibh ACA31 |
Par retorta (TP) | 0-100 |
Unius modi fibra (SM) 9/125 µm | vide SFP fibra moduli M-SFP-xx / M-Fast SFP-xx |
Unius modi fibra (LH) 9/125 µm (transceiver longum bolum) | vide SFP fibra moduli M-SFP-xx / M-Fast SFP-xx |
Fibra multimodi (MM) 50/125 µm | vide SFP fibra moduli M-SFP-xx / M-Fast SFP-xx |
Fibra multimodi (MM) 62.5/125 µm | vide SFP fibra moduli M-SFP-xx / M-Fast SFP-xx |
Linea - / stella topology | quis |
Operans intentione | 1 x 60 - 250 VDC (48V - 320 VDC) et 110 - 230 VAC (88 - 265 VAC) |
Virtus consummatio | 19 W |
Power output in BTU (IT)/h | 65 |
operating temperatus | -40-+70 °C |
Nota | IEC 60068-2-2 Arida Caloris Test +85°C 16 Horae |
Repono / onerariis temperatus | -40-+85 °C |
Humiditas relativa (non-condensatione) | 10-95 % |
Tutela pingere in PCB | Ita (conformal coating) |
Dimensiones (WxHxD) | 98 mm x 164 mm x 120 mm |
Pondus | 1500 g |
Adscendens | DIN rail |
Praesidium classis | IP20 |
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